Welding Rod
THE FUTURE IS FORGED IN THE DISTANCE. QUALITY OF SURVIVAL, HARMONIOUS DEVELOPMENT.

Welding Rod

  • Copper Phosphorus Silver Electrode 2% Silve Rod /5% Silve Rod /15% Silve Rod

    Copper Phosphorus Silver Electrode 2% Silve Rod /5% Silve Rod /15% Silve Rod

    Containing 2% silver, bag-2b is equivalent to American Standard AWS Bcup-6, national standard bcu91pag and L209. It has good fluidity and filling capacity. It is widely used for brazing copper and copper alloys in air conditioning, refrigerator, electromechanical and other industries. Melting point 645-790 ° C. Composition: Ag: 1.8 ~ 2.2 P: 6.8 ~ 7.2 Cu: residual.

  • Silver Copper Zinc Solder

    Silver Copper Zinc Solder

    Bag-18bsn contains 18% silver. It is an alloy of silver, copper, zinc and tin. It has a slightly higher melting range, good wettability and filling performance, and the price is economical. It can weld copper, copper alloy, steel and other materials. Melting point 770-810 ° C.

    Bag-25bsn contains 25% silver, which is equivalent to American Standard AWS bag-37. It is an alloy of silver, copper, zinc and tin. Its melting point is lower than hag-25b, which improves wettability and filling ability. Weldable copper, steel and other materials. Melting point 680-780 ° C.

    Bag-30b contains 30% silver, which is equivalent to American Standard AWS bag-20 and national standard bag30cuzn. It is a silver, copper and zinc alloy with slightly higher melting point and better toughness. It can braze copper, copper alloy, steel and other materials. Melting point 677-766 ° C.

  • Silver Copper Zinc Cadmium Solder

    Silver Copper Zinc Cadmium Solder

    BAg20CuZnCd It contains 20% silver, low melting point, good fluidity, smooth brazing joint, and can braze copper and copper alloy, steel and stainless steel. Composition: Cu: 34 ~ 36, Ag:: 19 ~ 21, Zn: 29 ~ 33, CD: 14 ~ 16, Si: residual Solidus 620 ℃, liquidus 730 ℃.

  • Phosphor Copper Flat Bar

    Phosphor Copper Flat Bar

    Model: Bcu93p

    AWS: Bcup-2

    Payment methods: letter of credit, wire transfer.